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1 ceramic pin-grid array package
керамический корпус с матрицей стержневых выводов, корпус типа CPGA, CPGA-корпусEnglish-Russian electronics dictionary > ceramic pin-grid array package
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2 ceramic pin-grid array package
керамический корпус с матрицей стержневых выводов, корпус типа CPGA, CPGA-корпусThe New English-Russian Dictionary of Radio-electronics > ceramic pin-grid array package
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3 package
1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе3) блок; узел; модуль; сборка4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)6) (полностью) укомплектованное программное обеспечение ( для розничной торговли); стандартное программное обеспечение•- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead package
- beam-lead integrated circuit package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic-and-metal package - ceramic pin-grid array package - chip package - command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt package
- deca-watt I-leads package
- double-prong package - FEB package
- flangeless package
- flange-sealed package
- flat package
- flat package G
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package - high-energy leadless package
- high thermal plastic-ball grid array package
- inserted package
- integrated-circuit package
- integrated program package - micro ball-grid array package
- microcircuit package
- microepoxy package - modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package - sensory package - single-chip package - single-prong package
- skinny dual in-line package
- small outline package
- small outline J-leaded package
- small outline large package
- small outline transistor package
- small vertical package
- socket mounted package
- software package
- software compression-decompression package
- standard package
- standard inserted package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package - surface vertical package
- tape carrier package
- telemetering package - top-brazed package
- transistor-outline package -
4 package
1) упаковка (1. упакованный предмет или группа предметов 2. товарная единица 3. упаковочный материал; тара; контейнер; капсула; коробка; ящик) || упаковывать, помещать в упаковку; укладывать2) корпус (напр. ИС) || корпусировать, помещать в корпус; изготавливать в корпусе3) блок; узел; модуль; сборка4) пакет (напр. компьютерных программ); блок (напр. телевизионных программ) || формировать пакет(ы) (напр. компьютерных программ), пакетировать; компоновать блок (напр. телевизионных программ)5) набор; комплект (напр. оборудования) || изготавливать или поставлять в виде набора или комплекта6) (полностью) укомплектованное программное обеспечение ( для розничной торговли); стандартное программное обеспечение•- all-metal package
- area array surface mounted package
- ball-grid array package
- beam-lead integrated circuit package
- beam-lead package
- benchmark package
- bottom-brazed package
- bubble package
- CAD package
- cartridge package
- ceramic dual in-line package
- ceramic pin-grid array package
- ceramic quad flat package
- ceramic-and-metal package
- ceramic-glass-metal package
- chaff package
- chip package
- chip scale package
- coaxial package
- command-driven package
- computer-aided design package
- control package
- cordwood package
- deca-watt I-leads package
- deca-watt package
- double-prong package
- dual flat package with flat leads
- dual flat package
- dual in-line package
- FEB package
- flangeless package
- flange-sealed package
- flat package G
- flat package
- flat surface mounted package
- functional electronic block package
- graphics package
- guidance package
- heat-sink dual in-line package
- heat-sink quad flat package
- heat-sink single in-line package
- heat-sink small outline package
- heat-sink zigzag in-line package
- hermetic package
- high thermal plastic-ball grid array package
- high-energy leadless package
- inserted package
- integrated program package
- integrated-circuit package
- low-profile quad flat package
- metal electrode face bonded package
- micro ball-grid array package
- micro small outline package
- microcircuit package
- microepoxy package
- microwave package
- modular accounting package
- multichip package
- multilayer molded package
- pancake package
- peripheral-leaded package
- pill package
- plastic dual in-line package
- plastic quad flat package
- plastic small outline package
- plug-in package
- power flat package
- program package
- quad flat package with flat leads
- quad flat package with J-leads
- quad flat package
- quad in-line package
- radar package
- rectangular single in-line package
- self-contained package
- sensory package
- shrink dual in-line package
- shrink inserted package
- shrink single in-line package
- shrink small outline large package
- shrink small outline package
- shrink zigzag in-line package
- side-brazed package
- single edge processor package
- single in-line package
- single-chip package
- single-prong package
- skinny dual in-line package
- small outline J-leaded package
- small outline large package
- small outline package
- small outline transistor package
- small vertical package
- socket mounted package
- software compression-decompression package
- software package
- standard inserted package
- standard package
- statistical package for social sciences
- stripline package
- stud package
- subroutine package
- surface horizontal package
- surface mount device package
- surface mount discrete package
- surface mounted package
- surface vertical package
- tape carrier package
- telemetering package
- thin quad flat package
- thin shrink outline L-leaded package
- thin small outline package I
- thin small outline package II
- thin small outline package
- TO package
- top-brazed package
- transistor-outline package
- ultra thin profile quad flat package
- ultra thin quad flat package
- very shrink pitch quad flat package
- windowed dual in-line package
- windowed small outline package
- zigzag in-line packageThe New English-Russian Dictionary of Radio-electronics > package
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5 package
2) тара3) упаковывание || упаковывать4) пачка; пакет6) набор; комплект7) набивка; уплотнение8) исполнение, вариант ( изготовления автомобиля)10) корпус || помещать в корпус; монтировать в корпусе11) вчт. пакет программ12) текст., швейн. паковка13) полигр. декель•-
accounting package
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aerosol package
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airborne guidance package
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airproof package
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anger package
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antifreeze package
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application package
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aseptic package
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beam-lead package
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benchmark package
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biodegradable package
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blade package
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blister package
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breathing package
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bucket teeth package
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canvas straps sustension package
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ceramic dual in-line package
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ceramic package
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chaff package
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chip package
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chip-carrier package
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CNC rebuild package
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coaxial package
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competent CNC package
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component package
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consumer package
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control package
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core lower package
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core upper package
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cutting edge package
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debug package
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design package
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development package
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DIL package
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disposable package
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distributed intelligence interactive drafting package
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distributed drafting package
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drafting package
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drive engineering package
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dual-in-line package
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dyeing package
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electronic control package
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engine powered package
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filter-regulator-lubricator package
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fleatlag package
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gasket package
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glass package
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graphics software package
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graphics package
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gravel package
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guidance package
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hardware and software package
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hybrid package
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immediate package
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individual package
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integrated package
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integrated-circuit package
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interior package
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large-sized package
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large-size package
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leadless package
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loose package
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low-profile package
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memory package
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molded package
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multichip package
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multiple package
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multiple-in-line package
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multiway package
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NC-IM package
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net package
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one-snot package
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palletized package
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pill package
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pin-grid array package
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pin-grid package
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plug-in package
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primary package
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production package
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production testing equipment package
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program package
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quadruple-in-line package
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quad-in-line package
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radar package
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retrofit package
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returnable package
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secondary package
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shrink package
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single in-line package
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skin package
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small-outline package
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small-outline transistor package
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SO package
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software package
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SOT package
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spent full package
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spray package
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spring suspension package
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stretch package
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stripline package
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supply package
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system package
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TAB package
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tailor-made package
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take-up package
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tape automated bonding package
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tape suspension package
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telemetering package
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tension spring package
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testing and debugging package
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thermoformed plastic package
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throw-away package
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tintsoft package
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TO package
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tropical package
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unit package
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vacuum-formed package -
6 PGA
(Pin Grid Array) матрица штырьковых выводов; корпус PGAтип керамического корпуса микросхемы, например микропроцессора; корпус с матрицей [расположенных в виде концентрических прямоугольников] штырьковых выводов, число которых может достигать 600, использовался многими х86-совместимыми процессорами.The R10000 microprocessor is available in 527 pin PGA package and is fabricated using a CMOS sub 0.5-micron silicon technology. — Микропроцессор R10000 изготавливается в 527-контактном корпусе PGA и по 0,5-микронной кремниевой CMOS-технологии см. тж. BGA, ceramic package, LGA, OLGA, PGA slot, PPGA, PQFP, SPGA
Англо-русский толковый словарь терминов и сокращений по ВТ, Интернету и программированию. > PGA
См. также в других словарях:
Ceramic pin grid array — 133 MHz Pentium chip in a ceramic package You may be looking for Cornish Pilot Gig Association. CPGA stands for Ceramic Pin Grid Array, a type of packaging used by integrated circuits. This type of packaging uses a ceramic substrate with… … Wikipedia
Pin grid array — A pin grid array, often abbreviated PGA, refers to the arrangement of pins on the integrated circuit packaging. In a PGA, the pins are arranged in a square array that may or may not cover the bottom of the package. The pins are commonly spaced… … Wikipedia
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Ball grid array — For other uses, see BGA (disambiguation). Intel Embedded Pentium MMX (bottom view) A ball grid array (BGA) is a type of surface mount packaging used for integrated circuits. Contents … Wikipedia
Fine Pitch Ball Grid Array — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik … Deutsch Wikipedia
Ball Grid Array — Zwei CPLDs in MBGA Bauweise auf einem USB Stecker. Gut zu erkennen sind die Lotperlen mit einem Abstand von 0.5 mm … Deutsch Wikipedia
Chip Scale Package — Ein Embedded Intel Pentium MMX in BGA Bauweise von unten gesehen. Gut zu erkennen sind die Lotperlen. Beidseitig bestückte Platine in BGA Technik … Deutsch Wikipedia
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
Quad-flat no-leads package — 28 pin QFN, upside down to show contacts and thermal/ground pad Flat no leads packages such as QFN (quad flat no leads) and DFN (dual flat no leads) physically and electrically connect integrated circuits to printed circuit boards. Flat no leads … Wikipedia
Chip carrier — A standard sized 8 pin dual in line package (DIP) containing a 555 timer IC. A chip carrier, also known as a chip container or chip package, is a container for a transistor or an integrated circuit. The carrier usually provides metal leads, or… … Wikipedia
